Techniques and configurations to control movement and position of surface mounted electrical devices

ABSTRACT

Embodiments of the present disclosure are directed towards techniques and configurations to control movement and position of surface mounted electrical devices. In one embodiment, an electrical contact includes a leg portion configured to extend in a first direction, a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint, a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape, and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. Other embodiments may be described and/or claimed.

FIELD

Embodiments of the present disclosure generally relate to the field ofintegrated circuits, and more particularly, to techniques andconfigurations to control movement and position of surface mountedelectrical devices.

BACKGROUND

Currently, electrical components may be coupled with a substrate such asa circuit board using Surface Mount Technology (SMT). For example, asolder reflow process may be used to form solder joints betweencorresponding electrical contacts on a socket assembly and a circuitboard. Emerging socket assemblies may include multiple, discretecomponents that are coupled with the circuit board by solder joints.However, during a solder reflow process to couple such discretecomponents with the circuit board, molten solderable material may wickor wet the electrical contact surfaces of the socket assembly or circuitboard in a manner that causes repositioning between the individualcomponents of the socket assembly relative to one another. Therepositioning may cause misalignment between the socket assemblycomponents and the circuit board resulting in solder joint defects suchfailure to make electrical contact between the socket assembly and thecircuit board.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments will be readily understood by the following detaileddescription in conjunction with the accompanying drawings. To facilitatethis description, like reference numerals designate like structuralelements. Embodiments are illustrated by way of example and not by wayof limitation in the figures of the accompanying drawings.

FIG. 1 schematically illustrates a perspective view of an exampleintegrated circuit (IC) package assembly, in accordance with someembodiments.

FIG. 2 schematically illustrates a top view of an IC package assembly,in accordance with some embodiments.

FIG. 3 schematically illustrates a cross-section side view of asubstrate with electrical contacts, in accordance with some embodiments.

FIGS. 4a-4b schematically illustrate a cross-section side view ofposition of an electrical contact relative to solderable material duringsolder joint formation, in accordance with some embodiments.

FIGS. 5a-5b schematically illustrate a cross-section side view ofposition of an electrical contact relative to solderable material duringsolder joint formation, in accordance with some embodiments.

FIG. 6 schematically illustrates a bottom view of position of anelectrical contact relative to solderable material during solder jointformation, in accordance with some embodiments.

FIG. 7 schematically illustrates a flow diagram for a method offabricating an IC package assembly, in accordance with some embodiments.

FIG. 8 schematically illustrates a computing device that includes an ICpackage assembly as described herein, in accordance with someembodiments.

DETAILED DESCRIPTION

Embodiments of the present disclosure describe techniques andconfigurations to control movement and position of surface mountedelectrical devices. In the following description, various aspects of theillustrative implementations will be described using terms commonlyemployed by those skilled in the art to convey the substance of theirwork to others skilled in the art. However, it will be apparent to thoseskilled in the art that embodiments of the present disclosure may bepracticed with only some of the described aspects. For purposes ofexplanation, specific numbers, materials and configurations are setforth in order to provide a thorough understanding of the illustrativeimplementations. However, it will be apparent to one skilled in the artthat embodiments of the present disclosure may be practiced without thespecific details. In other instances, well-known features are omitted orsimplified in order not to obscure the illustrative implementations.

In the following detailed description, reference is made to theaccompanying drawings which form a part hereof, wherein like numeralsdesignate like parts throughout, and in which is shown by way ofillustration embodiments in which the subject matter of the presentdisclosure may be practiced. It is to be understood that otherembodiments may be utilized and structural or logical changes may bemade without departing from the scope of the present disclosure.Therefore, the following detailed description is not to be taken in alimiting sense, and the scope of embodiments is defined by the appendedclaims and their equivalents.

For the purposes of the present disclosure, the phrase “A and/or B”means (A), (B), or (A and B). For the purposes of the presentdisclosure, the phrase “A, B, and/or C” means (A), (B), (C), (A and B),(A and C), (B and C), or (A, B and C).

The description may use perspective-based descriptions such astop/bottom, in/out, over/under, and the like. Such descriptions aremerely used to facilitate the discussion and are not intended torestrict the application of embodiments described herein to anyparticular orientation.

The description may use the phrases “in an embodiment,” or “inembodiments,” which may each refer to one or more of the same ordifferent embodiments. Furthermore, the terms “comprising,” “including,”“having,” and the like, as used with respect to embodiments of thepresent disclosure, are synonymous.

The term “coupled with,” along with its derivatives, may be used herein.“Coupled” may mean one or more of the following. “Coupled” may mean thattwo or more elements are in direct physical or electrical contact.However, “coupled” may also mean that two or more elements indirectlycontact each other, but yet still cooperate or interact with each other,and may mean that one or more other elements are coupled or connectedbetween the elements that are said to be coupled with each other. Theterm “directly coupled” may mean that two or more elements are in directcontact.

In various embodiments, the phrase “a first feature formed, deposited,or otherwise disposed on a second feature,” may mean that the firstfeature is formed, deposited, or disposed over the second feature, andat least a part of the first feature may be in direct contact (e.g.,direct physical and/or electrical contact) or indirect contact (e.g.,having one or more other features between the first feature and thesecond feature) with at least a part of the second feature.

As used herein, the term “module” may refer to, be part of, or includean Application Specific Integrated Circuit (ASIC), an electroniccircuit, a system-on-chip (SoC), a processor (shared, dedicated, orgroup) and/or memory (shared, dedicated, or group) that execute one ormore software or firmware programs, a combinational logic circuit,and/or other suitable components that provide the describedfunctionality.

FIG. 1 schematically illustrates a perspective view of an exampleintegrated circuit (IC) package assembly 100, in accordance with someembodiments. The IC package assembly 100 may include a socket assembly104 coupled with a circuit board or other suitable electronic substrate(“hereinafter circuit board 102”). The IC package assembly 100 mayfurther include a die or die package (hereinafter “die package 106”)electrically coupled with the circuit board 102 through the socketassembly 104.

The socket assembly 104 may include, for example, a land-grid array(LGA) socket having an array of electrical contacts that are configuredto route electrical signals between the die package 106 and the circuitboard 102. According to various embodiments, the electrical contacts ofthe socket assembly 104 may comport with embodiments described herein.For example, in some embodiments, the electrical contacts of the socketassembly may comport with embodiments described in connection with FIGS.5a-b and FIG. 6 to control movement and position of the socket assembly104 relative to the circuit board 102. The socket assembly 104 maycomport with embodiments described in connection with FIGS. 2-3.

In some embodiments, the circuit board 102 may be a printed circuitboard (PCB) composed of an electrically insulative material such as anepoxy laminate. The circuit board 102 may include electricallyinsulating layers composed of materials such as, for example,polytetrafluoroethylene, phenolic cotton paper materials such as FlameRetardant 4 (FR-4), FR-1, cotton paper and epoxy materials such as CEM-1or CEM-3, or woven glass materials that are laminated together using anepoxy resin prepreg material. Interconnect structures (not shown) suchas traces, trenches, vias may be formed through the electricallyinsulating layers to route the electrical signals of the die package 106through the circuit board 102. The circuit board 102 may be composed ofother suitable materials in other embodiments. For example, in someembodiments, the circuit board 102 is an epoxy-based laminate substratehaving a core and/or build-up layers such as, for example, an AjinomotoBuild-up Film (ABF) substrate. In some embodiments, the circuit board102 is a motherboard (e.g., motherboard 802 of FIG. 8).

The die package 106 may include one or more dies in any of a widevariety of suitable configurations. For example, the die package 106 maybe a central processing unit (CPU) package in one embodiment. The diepackage 106 may include one or more dies that are encapsulated, at leastpartially, in a protective enclosure such as, for example, a moldcompound or other suitable protective housing. In some embodiments, thedie package 106 may include alignment features to facilitate coupling ofthe die package 106 with corresponding features of the socket assembly104.

The die package 106 may include one or more dies made from asemiconductor material (e.g., silicon) and having circuitry formed usingsemiconductor fabrication techniques such as thin film deposition,lithography, etching and the like used in connection with forming CMOSdevices. In some embodiments, the one or more dies of the die package106 may be, include, or be a part of a processor, memory, SoC or ASIC.The one or more dies in the die package 106 may include a wide varietyof configurations including, for example, suitable combinations offlip-chip and/or wire-bonding configurations, interposers, multi-chippackage configurations including system-in-package (SiP) and/orpackage-on-package (PoP) configurations.

FIG. 2 schematically illustrates a top view of an IC package assembly200, in accordance with some embodiments. The IC package assembly 200may include a circuit board 102 and a socket assembly 104 coupled withthe circuit board 102 using a plurality of electrical contacts.

In some embodiments, the socket assembly 104 may be composed of two ormore discrete portions (e.g., physically separate from one another priorto coupling to the circuit board 102 and, in some cases, after couplingto the circuit board 102). For example, in the depicted embodiment, thesocket assembly 104 includes a first portion 104 a and a second portion104 b, each of which may be coupled with the circuit board 102 usingelectrical contacts as described herein. In other embodiments, thesocket assembly 104 may include more discrete portions than depicted.

FIG. 3 schematically illustrates a cross-section side view of asubstrate 304 with electrical contacts 308, in accordance with someembodiments. The substrate 304 may represent a portion of the socketassembly 104 of FIGS. 1-2 in some embodiments. In other embodiments, thesubstrate 304 may represent a substrate of another suitable electronicassembly (e.g., interposer, die package substrate, optics, connectors,etc.).

In some embodiments, the substrate 304 may include a plurality ofopenings 306 disposed between a first side and opposing second side ofthe substrate 304, as can be seen. The electrical contacts 308 may bephysically coupled with the substrate 304 in corresponding openings ofthe plurality of openings 306. For example, the electrical contacts 308may be physically coupled with the substrate 304 using mechanicalstitching features. In some embodiments, the electrical contacts 308 mayextend through the openings 306 to route electrical signals such as, forexample, input/output (I/O) signals or power/ground of a die (e.g., diepackage 106 of FIG. 1), through the substrate 304.

The substrate 304 may be composed of any of a wide variety of suitablematerials including, for example polymers, ceramics or semiconductormaterials. The substrate 304 may be composed of other suitable materialsin other embodiments.

The electrical contacts 308 may be leads of an LGA socket configurationin some embodiments. For example, the electrical contacts 308 may beJ-leads, which may be so named because, from a side view, each of theJ-leads may have a profile resembling the letter J, as can be seen. Theelectrical contacts 308 may be composed of an electrically conductivematerial such as metal.

In some embodiments, each of the electrical contacts 308 may have acontact portion 308 a, a leg portion 308 b, a heel portion 308 c, a footportion 308 d and a toe portion 308 e, as can be seen. The contactportion 308 a may extend beyond a surface of the substrate 304 to makeelectrical contact with corresponding interconnect features on a diepackage (e.g., die package 106 of FIG. 1). The leg portion 308 b mayextend through the openings 306. The heel portion 308 c may adjoin theleg portion 308 b and the foot portion 308 d. The foot portion 308 d(sometimes referred to as “paddle”) may have a surface that isconfigured to directly coupled with solderable material 310 (e.g.,solder ball) to form a solder joint (e.g., between a socket assembly 104and a circuit board 102 of FIGS. 1-2). The toe portion 308 d may be aterminating end of the foot portion 308 d opposite to the heel portion308 c.

In some embodiments, the leg portion 308 b may extend in a firstdirection, indicated by x-axis, and the foot portion 308 d may include asurface that extends in a second direction, indicated by y-axis, that isperpendicular to the first direction, as can be seen. In variousembodiments, the leg portion 308 b may extend away from the surface ofthe foot portion 308 d at an angle that is substantially perpendicular(e.g., +/−10° of being perpendicular).

In some embodiments, the electrical contacts 308 may comport withembodiments described in connection with FIGS. 5a-b . For example, insome embodiments, the toe portion 308 e may have a profile shape that issymmetric with a profile shape of the heel portion 308 c. The profileshape of the electrical contacts 308 is merely one example and mayinclude any of a wide variety of other profile shapes in otherembodiments.

FIGS. 4a-4b schematically illustrate a cross-section side view ofposition of an electrical contact 400 relative to solderable material310 during solder joint formation, in accordance with some embodiments.The electrical contact 400 may include a leg portion 408 b, heel portion408 c, foot portion 408 d and toe portion 408 e, coupled as can be seen.

FIG. 4a may represent the electrical contact 400 after depositingsolderable material 310 onto a surface of the foot portion 408 d, as canbe seen. An original position of a center of mass of the solderablematerial 310 is represented by line 444.

FIG. 4b may represent the electrical contact 400 during or subsequent toperforming a solder ball reflow process to form a solder joint betweenthe electrical contact 400 and a pad 112 or other electrical contactdisposed on an electronic substrate (e.g., circuit board 102 of FIGS.1-2) using the solderable material 310. During the solder reflowprocess, the solderable material 310 may wick or wet up the heel portion408 c of the electrical contact 400, which may shift the center of massof the solderable material 310 toward the heel portion 408 c to apost-reflow position represented by line 446, as can be seen. Becausethe center of mass of mass of the solderable material 310 wants to becentered at a center of the pad 112, the electrical contact 400 may moveto the right in relation to the pad 112 (e.g., towards the toe portion408 e). Such movement of the electrical contact 400 when combined withother electrical contacts 400 that are similarly configured may move anentire socket assembly (e.g., socket assembly 104 of FIG. 1 or firstportion 104 a/second portion 104 b of FIG. 2) in a same direction as theelectrical contact 400 (e.g., to the right in the depicted embodiment).

FIGS. 5a-5b schematically illustrate a cross-section side view ofposition of an electrical contact 500 relative to solderable material310 during solder joint formation, in accordance with some embodiments.The electrical contact 500 may include a leg portion 508 b, heel portion508 c, foot portion 508 d and toe portion 508 e, coupled as can be seen.

Principles of solder wicking movement described in connection with FIGS.4a-4b may be used to control (e.g., mitigate or steer) movement of theelectrical contact 500 relative to the pad 112. For example, FIG. 5a mayrepresent the electrical contact 500 after depositing solderablematerial 310 onto a surface of the foot portion 508 d, as can be seen.The solderable material 310 may generally center on the flat surface ofthe foot portion 508 d. An original position of a center of mass of thesolderable material 310 is represented by line 544.

The toe portion 508 e may be configured with a profile shape thatsymmetrically matches the profile shape of the heel portion 508 c. Forexample, in the depicted embodiment, the toe portion 508 e may curve andpoint upwards (e.g., in the direction of the y-axis) in a mirror-imageof the heel portion 508 c across the original position of the center ofmass, which may correspond with a center (e.g., in the direction of thex-axis) of the flat surface of the foot portion 508 d as can be seen.The toe portion 508 e may include a wicking surface that matches thewicking surface of the heel portion 408 c.

FIG. 5b may represent the electrical contact 500 during or subsequent toperforming a solder ball reflow process to form a solder joint betweenthe electrical contact 500 and a pad 112 or other electrical contactdisposed on an electronic substrate (e.g., circuit board 102 of FIGS.1-2) using the solderable material 310. During the solder reflowprocess, the solderable material 310 may want to equally wick or wet upthe heel portion 508 c and the toe portion 508 e of the electricalcontact 400, which may stop or prevent movement of the electricalcontact 500 relative to the pad 112 as described in connection with FIG.4 b.

In some embodiments, a radius of the curve of the heel portion 408 c andthe toe portion 408 e may have a radius that is equal to or greater thanthree times the thickness of the electrical contact. The heel portion508 c and the toe portion 508 e may have other suitable profile shapesthat are symmetrical.

FIG. 6 schematically illustrates a bottom view of position of anelectrical contact 600 relative to solderable material during solderjoint formation, in accordance with some embodiments. The electricalcontact 600 may include at least a heel portion 608 c and foot portion608 d. In some embodiments, the electrical contact 600 may furtherinclude a toe portion (e.g., toe portion 508 e) as described inconnection with FIGS. 5a -b.

The electrical contact is described in reference to a z-axis and x-axis.The z-axis may extend in a direction that is perpendicular orsubstantially perpendicular to the x-axis and y-axis of FIGS. 3, 4 a,and 5 a. The x-axis represents a same direction as described in FIGS. 3,4 a, and 5 a.

As can be seen, a first portion of the surface of the foot portion 608 dextends up in the direction of the z-axis relative to the heel portion608 c and a second portion of the surface of the foot portion 608 dextends down in the direction of the z-axis relative to the heel portion608 c. A distance between a terminating edge 660 of the first portionand the heel portion 608 c may be greater than a distance between aterminating edge 662 of the second portion and the heel portion 608 c,as can be seen. Such asymmetric configuration of the first portionrelative to the second portion may cause a center of mass of asolderable material to shift towards the second portion.

For example, line 644 and 644 a may intersect at a point that representsa center of mass of solderable material if the first portion and thesecond portion of the foot portion 608 d are equidistant from the heelportion 608 c (e.g., the second portion extends the same distancerelative to the heel portion 608 c as shown for the first portion inFIG. 6). A contact area of the solderable material on the surface of thefoot portion 608 d in such embodiment may be represented by line 650 a.

However, in the case where the second portion extends further in thez-axis relative to the heel portion 608 c than the first portion, asdepicted, a center of mass of the solderable material may shift down inthe z-direction towards the second portion to center on the surface ofthe foot portion 608 d. For example, line 644 and 644 b may intersect ata point that represents a center of mass of solderable material for suchembodiment and a contact area of the solderable material on the surfaceof the foot portion 608 d may be represented by line 650 b.

These principles may be used to design electrical contacts to controlmovement during solder reflow. Controlling the movement of theelectrical contact 600 may allow mitigation of misalignment of a socketassembly (e.g., socket assembly 104 of FIGS. 1-2) that may be caused byany undesired movement. For example, if upward movement in thez-direction of the electrical contact 600 (e.g., or a socket assemblyincluding the electrical contact 600) is desired, then the configurationof the electrical contact 600 would provide such movement because as thecenter of mass of the solderable material shifts down in the z-axisdirection, a resultant movement of the foot portion 608 d upward in thez-direction would result because a center of mass of the solderablematerial would preferentially align towards a center of a correspondingpad (e.g., pad 112 of FIG. 5b ).

FIG. 7 schematically illustrates a flow diagram for a method 700 offabricating an IC package assembly (e.g., IC package assembly 100 or 200of respective FIG. 1 or 2), in accordance with some embodiments. Themethod 700 may comport with embodiments described in connection withFIGS. 1-6.

At 702, the method 700 may include providing an electrical contact(e.g., electrical contact 500 of FIGS. 5a-b ) having a leg portion(e.g., leg portion 508 b of FIGS. 5a-b ) configured to extend in a firstdirection (e.g., y-axis direction of FIGS. 5a-b ), a foot portion (e.g.,foot portion 508 d of FIGS. 5a-b ) coupled with the leg portion, thefoot portion having a surface that extends in a second direction (e.g.,x-axis direction of FIGS. 5a-b ) that is substantially perpendicular tothe first direction, a heel portion (e.g., heel portion 508 c of FIGS.5a-b ) adjoining the leg portion and the foot portion, the heel portionhaving a profile shape, and a toe portion (e.g., toe portion 508 e ofFIGS. 5a-b ) extending from the foot portion and disposed opposite tothe heel portion, the toe portion having a profile shape that issymmetric with the profile shape of the heel portion. In someembodiments, the electrical contact may further include an arrangementas described in connection with FIG. 6.

At 704, the method 700 may include bringing the surface of the footportion into contact with solderable material (e.g., solderable material310) of FIGS. 5a-b . In some embodiments, the solderable material mayinclude solder balls that are deposited on the surface of the footportion. A first solder reflow process may be performed to form a solderconnection between the solderable material and the surface of the footportion. In other embodiments, the solderable material may be depositedon a pad of a circuit board using a first reflow process and thesolderable material may be brought into solderable contact with thesurface of the foot portion in preparation for a second reflow process.

At 706, the method 700 may include performing a solder reflow process toform a solder joint between the surface of the foot portion and a pad(e.g., pad 112 of FIGS. 5a-b ) disposed on a circuit board (e.g.,circuit board 102 of FIGS. 1-2), the molten solderable material equallywetting the heel portion and the toe portion during the reflow process.The solder reflow process may be a second reflow process relative to afirst reflow process performed at 704 to couple the solderable materialwith the surface of the foot portion or the pad of the circuit board asdescribed. Various operations are described as multiple discreteoperations in turn, in a manner that is most helpful in understandingthe claimed subject matter. However, the order of description should notbe construed as to imply that these operations are necessarily orderdependent.

Embodiments of the present disclosure may be implemented into a systemusing any suitable hardware and/or software to configure as desired.FIG. 8 schematically illustrates a computing device 800 that includes anIC package assembly (e.g., IC package assembly 100 or 200 of respectiveFIG. 1 or 2) as described herein, in accordance with some embodiments.The computing device 800 may house a board such as motherboard 802(e.g., in housing 808). The motherboard 802 may include a number ofcomponents, including but not limited to a processor 804 and at leastone communication chip 806. The processor 804 may be physically andelectrically coupled to the motherboard 802. In some implementations,the at least one communication chip 806 may also be physically andelectrically coupled to the motherboard 802. In further implementations,the communication chip 806 may be part of the processor 804.

Depending on its applications, computing device 800 may include othercomponents that may or may not be physically and electrically coupled tothe motherboard 802. These other components may include, but are notlimited to, volatile memory (e.g., DRAM), non-volatile memory (e.g.,ROM), flash memory, a graphics processor, a digital signal processor, acrypto processor, a chipset, an antenna, a display, a touchscreendisplay, a touchscreen controller, a battery, an audio codec, a videocodec, a power amplifier, a global positioning system (GPS) device, acompass, a Geiger counter, an accelerometer, a gyroscope, a speaker, acamera, and a mass storage device (such as hard disk drive, compact disk(CD), digital versatile disk (DVD), and so forth).

The communication chip 806 may enable wireless communications for thetransfer of data to and from the computing device 800. The term“wireless” and its derivatives may be used to describe circuits,devices, systems, methods, techniques, communications channels, etc.,that may communicate data through the use of modulated electromagneticradiation through a non-solid medium. The term does not imply that theassociated devices do not contain any wires, although in someembodiments they might not. The communication chip 806 may implement anyof a number of wireless standards or protocols, including but notlimited to Institute for Electrical and Electronic Engineers (IEEE)standards including Wi-Fi (IEEE 802.11 family), IEEE 802.16 standards(e.g., IEEE 802.16-2005 Amendment), Long-Term Evolution (LTE) projectalong with any amendments, updates, and/or revisions (e.g., advanced LTEproject, ultra mobile broadband (UMB) project (also referred to as“3GPP2”), etc.). IEEE 802.16 compatible BWA networks are generallyreferred to as WiMAX networks, an acronym that stands for WorldwideInteroperability for Microwave Access, which is a certification mark forproducts that pass conformity and interoperability tests for the IEEE802.16 standards. The communication chip 806 may operate in accordancewith a Global System for Mobile Communication (GSM), General PacketRadio Service (GPRS), Universal Mobile Telecommunications System (UMTS),High Speed Packet Access (HSPA), Evolved HSPA (E-HSPA), or LTE network.The communication chip 806 may operate in accordance with Enhanced Datafor GSM Evolution (EDGE), GSM EDGE Radio Access Network (GERAN),Universal Terrestrial Radio Access Network (UTRAN), or Evolved UTRAN(E-UTRAN). The communication chip 806 may operate in accordance withCode Division Multiple Access (CDMA), Time Division Multiple Access(TDMA), Digital Enhanced Cordless Telecommunications (DECT),Evolution-Data Optimized (EV-DO), derivatives thereof, as well as anyother wireless protocols that are designated as 3G, 4G, 5G, and beyond.The communication chip 806 may operate in accordance with other wirelessprotocols in other embodiments.

The computing device 800 may include a plurality of communication chips806. For instance, a first communication chip 806 may be dedicated toshorter range wireless communications such as Wi-Fi and Bluetooth and asecond communication chip 806 may be dedicated to longer range wirelesscommunications such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, andothers.

The processor 804 of the computing device 800 may be packaged in an ICpackage assembly (e.g., IC package assembly 100 or 200 of respectiveFIG. 1 or 2) as described herein. For example, the circuit board 102 ofFIG. 1 or 2 may be a motherboard 802 and the processor 804 may be a dieof the die package 106 that is coupled with a socket assembly 104mounted on the circuit board 102 according to techniques andconfigurations described herein (e.g., using positioning of electricalcontact 500 or 600 of respective FIGS. 5a-b or 6). Other suitableconfigurations may be implemented in accordance with embodimentsdescribed herein. The term “processor” may refer to any device orportion of a device that processes electronic data from registers and/ormemory to transform that electronic data into other electronic data thatmay be stored in registers and/or memory.

The communication chip 806 may also include a die that may be packagedin an IC package assembly (e.g., IC package assembly 100 or 200 ofrespective FIG. 1 or 2) as described herein. In further implementations,another component (e.g., memory device or other integrated circuitdevice) housed within the computing device 800 may include a die thatmay be packaged in an IC package assembly (e.g., IC package assembly 100or 200 of respective FIG. 1 or 2) as described herein.

In various implementations, the computing device 800 may be a laptop, anetbook, a notebook, an ultrabook, a smartphone, a tablet, a personaldigital assistant (PDA), an ultra mobile PC, a mobile phone, a desktopcomputer, a server, a printer, a scanner, a monitor, a set-top box, anentertainment control unit, a digital camera, a portable music player,or a digital video recorder. The computing device 800 may be a mobilecomputing device in some embodiments. In further implementations, thecomputing device 800 may be any other electronic device that processesdata.

EXAMPLES

According to various embodiments, the present disclosure describes anelectrical contact for use in an integrated circuit (IC) packageassembly. Example 1 of an electrical contact may include a leg portionconfigured to extend in a first direction, a foot portion coupled withthe leg portion, the foot portion having a surface that extends in asecond direction that is substantially perpendicular to the firstdirection, the surface being configured to directly couple withsolderable material to form a solder joint, a heel portion adjoining theleg portion and the foot portion, the heel portion having a profileshape, and a toe portion extending from the foot portion and disposedopposite to the heel portion, the toe portion having a profile shapethat is symmetric with the profile shape of the heel portion. Example 2may include the electrical contact of Example 1, wherein the profileshape of the heel portion and the toe portion is curved. Example 3 mayinclude the electrical contact of Example 1, wherein the electricalcontact is a J-lead contact. Example 4 may include the electricalcontact of Example 1, wherein the electrical contact is configured foruse in a land-grid array (LGA) socket assembly. Example 5 may includethe electrical contact of any of Examples 1-4, wherein a first portionof the surface of the foot portion extends in a third direction that issubstantially perpendicular to the first direction and the seconddirection, a second portion of the surface of the foot portion extendsin a fourth direction that is opposite to the third direction, and adistance between a terminating edge of the first portion and the heelportion is greater than a distance between a terminating edge of thesecond portion and the heel portion. Example 6 may include theelectrical contact of any of Examples 1-4, further comprising a contactportion extending from the leg portion and configured to form anelectrical connection with a die package, wherein the electrical contactis configured to route ground or input/output (I/O) signals of the die.

According to various embodiments, the present disclosure describes amethod of forming a solder joint. Example 7 of a method may includeproviding an electrical contact comprising a leg portion configured toextend in a first direction, a foot portion coupled with the legportion, the foot portion having a surface that extends in a seconddirection that is substantially perpendicular to the first direction, aheel portion adjoining the leg portion and the foot portion, the heelportion having a profile shape, and a toe portion extending from thefoot portion and disposed opposite to the heel portion, the toe portionhaving a profile shape that is symmetric with the profile shape of theheel portion, bringing the surface of the foot portion into contact withsolderable material, and performing a reflow process to form a solderjoint between the solderable material and the surface, wherein duringthe reflow process, the molten solderable material equally wets the heelportion and the toe portion. Example 8 may include the method of Example7, wherein the profile shape of the heel portion and the toe portion iscurved. Example 9 may include the method of Example 7, wherein theelectrical contact is a J-lead contact. Example 10 may include themethod of Example 7, wherein the electrical contact is configured foruse in a land-grid array (LGA) socket assembly. Example 11 may includethe method of any of Examples 7-10, wherein a first portion of thesurface of the foot portion extends in a third direction that issubstantially perpendicular to the first direction and the seconddirection, a second portion of the surface of the foot portion extendsin a fourth direction that is opposite to the third direction, adistance between a terminating edge of the first portion and the heelportion is greater than a distance between a terminating edge of thesecond portion and the heel portion, and performing the solder reflowprocess, wherein during the reflow process, a center of gravity of themolten solderable material shifts to a position that is equidistant tothe terminating edge of the first portion and the terminating edge ofthe second portion. Example 12 may include the method of any of Examples7-10, further comprising a contact portion coupled with the leg portionand configured to form an electrical connection with a die package,wherein the electrical contact is configured to route ground orinput/output (I/O) signals of the die.

According to various embodiments, the present disclosure describes anintegrated circuit (IC) package assembly (e.g., a socket assembly).Example 13 of an IC package assembly may include a substrate having aplurality of openings disposed between a first side and opposing secondside of the substrate and a plurality of electrical contacts physicallycoupled with the substrate in corresponding openings of the plurality ofopenings, wherein individual electrical contacts of the plurality ofelectrical contacts each include a leg portion configured to extend in afirst direction, a foot portion coupled with the leg portion, the footportion having a surface that extends in a second direction that issubstantially perpendicular to the first direction, the surface beingconfigured to directly couple with solderable material to form a solderjoint, a heel portion adjoining the leg portion and the foot portion,the heel portion having a profile shape, and a toe portion extendingfrom the foot portion and disposed opposite to the heel portion, the toeportion having a profile shape that is symmetric with the profile shapeof the heel portion. Example 14 may include the IC package assembly ofExample 13, wherein the substrate includes two or more discreteportions, each of the two or more discrete portions includes at leastone of the plurality of electrical contacts disposed in an opening ofthe plurality of openings. Example 15 may include the IC packageassembly of Example 13, wherein the substrate is part of a socketassembly. Example 16 may include the IC package assembly of Example 13,further comprising a die electrically coupled with the plurality ofelectrical contacts. Example 17 may include the IC package assembly ofExample 16, wherein the die is housed in a die package that iselectrically coupled with the electrical contacts. Example 18 mayinclude the IC package assembly of Example 13, wherein the pluralitiesof electrical contacts are in a land-grid array (LGA) configuration.Example 19 may include the IC package assembly of any of Examples 13-18,wherein a first portion of the surface of the foot portion extends in athird direction that is substantially perpendicular to the firstdirection and the second direction, a second portion of the surface ofthe foot portion extends in a fourth direction that is opposite to thethird direction, and a distance between a terminating edge of the firstportion and the heel portion is greater than a distance between aterminating edge of the second portion and the heel portion. Example 20may include the IC package assembly of any of Examples 13-18, furthercomprising a contact portion coupled with the leg portion and configuredto form an electrical connection with a die package, wherein theelectrical contact is configured to route ground or input/output (I/O)signals of the die.

According to various embodiments, the present disclosure describes asystem (e.g., a computing device). Example 21 of a computing device mayinclude a circuit board, a socket assembly coupled with the circuitboard, the socket assembly comprising a substrate having a plurality ofopenings disposed between a first side and opposing second side of thesubstrate, and a plurality of electrical contacts physically coupledwith the substrate in corresponding openings of the plurality ofopenings, wherein individual electrical contacts of the plurality ofelectrical contacts each include a leg portion configured to extend in afirst direction, a foot portion coupled with the leg portion, the footportion having a surface that extends in a second direction that issubstantially perpendicular to the first direction, the surface beingdirectly coupled with solderable material to form a solder joint betweenthe circuit board and the socket assembly, a heel portion adjoining theleg portion and the foot portion, the heel portion having a profileshape, and a toe portion extending from the foot portion and disposedopposite to the heel portion, the toe portion having a profile shapethat is symmetric with the profile shape of the heel portion. Example 22may include the computing device of Example 21, further comprising a diepackage electrically coupled with the plurality of electrical contacts.Example 23 may include the computing device of any of Examples 21-22,wherein the computing device is a mobile computing device including oneor more of a display, a touchscreen display, a touchscreen controller, abattery, an audio codec, a video codec, a power amplifier, a globalpositioning system (GPS) device, a compass, a Geiger counter, anaccelerometer, a gyroscope, a speaker, or a camera coupled with thecircuit board.

Various embodiments may include any suitable combination of theabove-described embodiments including alternative (or) embodiments ofembodiments that are described in conjunctive form (and) above (e.g.,the “and” may be “and/or”). Furthermore, some embodiments may includeone or more articles of manufacture (e.g., non-transitorycomputer-readable media) having instructions, stored thereon, that whenexecuted result in actions of any of the above-described embodiments.Moreover, some embodiments may include apparatuses or systems having anysuitable means for carrying out the various operations of theabove-described embodiments.

The above description of illustrated implementations, including what isdescribed in the Abstract, is not intended to be exhaustive or to limitthe embodiments of the present disclosure to the precise formsdisclosed. While specific implementations and examples are describedherein for illustrative purposes, various equivalent modifications arepossible within the scope of the present disclosure, as those skilled inthe relevant art will recognize.

These modifications may be made to embodiments of the present disclosurein light of the above detailed description. The terms used in thefollowing claims should not be construed to limit various embodiments ofthe present disclosure to the specific implementations disclosed in thespecification and the claims. Rather, the scope is to be determinedentirely by the following claims, which are to be construed inaccordance with established doctrines of claim interpretation.

What is claimed is:
 1. An electrical contact for use in an integratedcircuit (IC) package assembly, the electrical contact comprising: a legportion configured to extend in a first direction; a foot portioncoupled with the leg portion, the foot portion having a surface todirectly couple with a solderable material to form a solder joint,wherein the surface is substantially perpendicular to the firstdirection; a heel portion adjoining the leg portion and the footportion, the heel portion having a profile shape; and a toe portionextending from the foot portion and disposed across the surface oppositethe heel portion, the toe portion including a profile shape that issymmetric with the profile shape of the heel portion, wherein: thesurface of the foot portion extends from the heel portion to the toeportion in a second direction and includes first and second opposedterminating edges that extend substantially parallel to the seconddirection; and a first distance between the heel portion and the firstterminating edge is greater than a second distance between the heelportion and the second terminating edge, wherein the profile shape ofthe heel portion and the toe portion is curved.
 2. The electricalcontact of claim 1, wherein the electrical contact is a J-lead contact.3. The electrical contact of claim 1, wherein the electrical contact isconfigured for use in a land-grid array (LGA) socket assembly.
 4. Theelectrical contact of claim 1, further comprising: a contact portionextending from the leg portion and configured to form an electricalconnection with a die package, wherein the electrical contact isconfigured to route ground or input/output (I/O) signals of the diepackage.
 5. The electrical contact of claim 1 wherein the heel portionis closer to the first terminating edge than to the second terminatingedge.
 6. The electrical contact of claim 1 wherein the heel portion andthe toe portion each include a solder wicking surface.
 7. An electricalcontact for use in an integrated circuit (IC) package assembly, theelectrical contact comprising: a leg portion configured to extend in afirst direction; a foot portion having a surface to directly couple witha solderable material to form a solder joint; a heel portion adjoiningthe leg portion and the foot portion, with the surface of the footportion substantially perpendicular to the first direction, the heelportion having a profile shape; and a toe portion extending from thefoot portion and disposed across the surface of the foot portionopposite the heel portion, the toe portion including a profile shapethat is symmetric with the profile shape of the heel portion, wherein;the surface of the foot portion extends from the heel portion to the toeportion in a second direction and includes first and second opposedterminating edges that extend substantially parallel to the seconddirection; and the heel portion is asymmetric with respect to the firstand second terminating edges, wherein the profile shape of the heelportion and the toe portion is curved.
 8. The electrical contact ofclaim 7, wherein the electrical contact is a J-lead contact.
 9. Theelectrical contact of claim 7, wherein the electrical contact isconfigured for use in a land-grid array (LGA) socket assembly.
 10. Theelectrical contact of claim 7 wherein the heel portion is closer to thefirst terminating edge than to the second terminating edge.
 11. Theelectrical contact of claim 7 wherein the heel portion and the toeportion each include a solder wicking surface.